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BGA64 is a common NAND flash package found in feature phones
With a built-in bootstrap circuit
Pin count: 14
Pack includes branded Orange Propellers
Cooling for small devices
MC TF350 Flux Paste for BGA RT809 BGA64 is a common NANDMC TF350 is a professional grade flux paste engineered for BGA (Ball Grid Array) soldering applications. Formulated with a balanced blend of activators and solvents, it delivers reliable wetting and excellent solder joint quality on fine pitch components. Ideal for electronics assembly, rework, and repair work where precision and consistency matter. The paste maintains optimal viscosity for controlled application and leaves minimal residue after
